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Cybersecurity Assurance & Policy (CAP) Center


Sponsored Research

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Research Areas

  • Hardware Security  
  • Side Channel Analysis (SCA)
    • Simple Power Analysis (SPA)
    • Differential Power Analysis (DPA)
    • Correlation Power Analysis (CPA)
    • Differential Electromagnetic Analysis (DEMA)
  • Fault Injection (FI)
  • System on Chip Design
  • Security-at-the-Edge
  • Secure System-on-Chip (SoC) Design (e.g., Intel 16 nm CMOS Technology)
  • Hardware/Software Reverse Engineering
  • Countermeasure Assessment and Development
  • Wireless Interface/Protocol Vulnerability Assessment (e.g., 5G, Matter, etc.)
  • Trustworthy AI

CyberCorps Scholarship for Service: Secure Embedded Systems

Start Date: July 15, 2021

End Date: June 30, 2028 (Estimated)

Total Intended Award Amount: $3,184,625.00

NSF Org: Division of Graduate Education (EDU/DGE)

Overview: This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria. This project is supported by the CyberCorps® Scholarship for Service (SFS) program, which funds proposals establishing or continuing scholarship programs in cybersecurity and aligns with the U.S. National Cyber Strategy to develop a superior cybersecurity workforce. Following graduation, scholarship recipients are required to work in cybersecurity for a federal, state, local, or tribal Government organization for the same duration as their scholarship support.

SaTC: Frontiers: Collaborative: Security and Privacy in the Lifecycle of IoT for Consumer Environments (SPLICE)

Start Date: October 01, 2020

End Date: September 30, 2026 (Estimated)

Total Intended Award Amount: $1,354,873.00

NSF Org: Division of Computer and Network Systems (CISE/CNS)

Overview: SPLICE research addresses issues important to these stakeholders including: (1) situational awareness for Smart-Home residents through new approaches that discover, identify, and locate both cooperative and non-cooperative devices, and discover information flows from such devices; (2) novel interfaces and discovery techniques that enable a new approach to privacy management, one that shifts the burden from end-users to consumer-proxy organizations that have the capability to evaluate the privacy posture of Smart Things; (3) a holistic conceptual framework for reasoning about privacy, based on SPLICE study of stakeholders’ perceptions and expectations of privacy in Smart Homes. 

A Microelectronics Workforce Development Program (SCALE)

Start Date: 

End Date: March 31, 2026

Total Intended Award Amount: $508,519.12

Org: Purdue SCALE

Overview: Purdue University and Morgan State University are collaborating on a microelectronics workforce development program through the Department of Defense (DoD)-funded Scalable Asymmetric Lifecycle Engagement (SCALE) network. Purdue leads the multi-university SCALE partnership in preparing the next generation of engineers and experts for careers in the defense and semiconductor industry. Morgan State University's involvement focuses on educating and training a diverse group of students for semiconductor manufacturing and design. 

IAC MAC BAH

Start Date: April 25, 2024

End Date: August 22, 2028

Total Intended Award Amount: $1,413,000.00

Org: Booz Allen 

Sponsor: Dept of Defense - Air Force Material Command